Wave Soldering Machine
A high-quality wave soldering machine for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, and very economical.
Features
- Heavy-duty, high-temperature pumps and motors
- Self cleaning nozzle and pressure tank
- Flux supply and flux flow-meter
- Automatic adjustment of PCB size
- three-zone, high-capacity, forced hot air convection preheater with independent zone temperature controls to allow precise thermal profiling
- Interchangeable pre-heat modules
Options
- Nitrogen supply tunnel system in solder pot area
- Top IR Quartz lamp pre-heater has the special function to achieve smart turn-on and turn-off
- Ultrasonic sprayer
- Automatic solder bar feeding system with safety solder level alarm system (6 solder bars capability)
- Receipt driven changing spraying width and wave heights automatically
- Heavy duty PCB wire support
Media
Laser Marking Machine Lineup
Any Application Anytime
This machine can be configured with dual waves to accommodate through-hole, surface mount and mixed-technology assemblies. The chip wave can be deactivated through the user interface for non-SMT applications, although the addition of the oscillating wave option will allow the chip wave to aid in hole fill and bridge reduction for difficult-to-solder boards of all technologies.
Heavy Duty Pumps and Motors
Dual, high-performance, high-temperature motors pump the molten solder through a titanium-alloy recirculating system and wave nozzles that are specially designed to minimize solder oxidation. Both motors include transducer-controlled flow adjustment to ensure precise wave height and uniformity.
Precise Fluxing System
A self-cleaning nozzle and pressure tank flux delivery system are included. Flux supply and flux flow-meter come as the standard configuration in the system, which allows it to save flux consumption and guarantees uniform spraying. An automatic internal spray fluxing system that features a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.
Titanium Finger Conveyor
Titanium Finger Conveyor Includes Motorized Width Adjustment, from 50-350mm (450mm), is standard on all HW Wave Soldering Systems. It dramatically reduces setup time and eliminating operator inconsistency. Other conveyor widths are available: 300 mm, 450mm.
An aluminum-alloy pin-type conveyor input mechanism feeds the dual- titanium-finger conveyor which includes a built-in finger cleaner. Conveyor angle is adjustable from 4°-7° and nominal speed setting is variable from 0.5 – 2.2m/min (20”-87”/min) for maximized throughput.
*An optional center PCB support rail can be added to maintain planarity and to prevent sagging of oversize boards through the wave module.
Nitrogen System
Using N2 to generate an inert atmosphere during wave soldering minimizes solder oxidation. This not only saves solder material and lessens maintenance requirements, but also improves solder wetting and ensures the quality of the formed solder joints. The use of nitrogen as a process gas provides an inert, reduced-oxygen soldering atmosphere. By eliminating the formation of solder oxides, a wetting state is promoted, thus soldering quality is improved.
Our nitrogen system in the wave soldering machine allows the lowest nitrogen consumption and PPM level, and decrease the solder dross as much as possible. The nitrogen tunnel is only placed on the solder pot area to achieve the economy nitrogen consumption.
*Standard configuration includes: Full nitrogen system in the solder pot area, nitrogen flow meter, oxygen analyzer, and air cooling chiller.
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